原始名称记载: SAMSUNG ELECTRO-MECHANICS CO., LTD.

A multilayer ceramic capacitor and a method of manufacturing the same, the multilayer ceramic capacitor including a capacitor body including a dielectric layer and an internal electrode layer, and an external electrode disposed on the outside of the capacitor body, wherein the internal electrode layer includes a metal layer including nickel (Ni); and a surface layer disposed on the surface of the metal layer and including bismuth (Bi), and the bismuth (Bi) is included in the surface layer in an amount of about 0.01 to about 5.3 parts by atom based on 100 parts by atom of nickel (Ni) present in the entire internal electrode layer.

A multilayer electronic component includes: a body including a dielectric layer and an internal electrode; and external electrodes disposed on the body. An average content of indium (In) relative to titanium (Ti) satisfies 0.3 at % or more and 3.8 at % or less in a region of the dielectric layer that is spaced apart by 2 nm from an interface thereof with the internal electrode.

The present disclosure relates to a printed circuit board including: a frame having a through-portion; a glass layer at least partially disposed within the through-portion; a first insulating material filling at least a portion of a space between the frame and the glass layer; a second insulating material disposed on upper sides of the frame and the glass layer; and a third insulating material disposed on lower sides of the frame and the glass layer, and the first insulating material includes a material different from the second and third insulating materials.

The present disclosure relates to a printed circuit board including: a substrate having a first through-portion; a metal pattern disposed on at least one surface of the substrate and extending onto a wall surface of the first through-portion; a first optical member disposed in the first through-portion; a dielectric layer disposed on the substrate, filling the first through-portion and covering each of the metal pattern and the first optical member, an optical waveguide pattern embedded in the dielectric layer and disposed on the substrate; and a mirror embedded in the dielectric layer and disposed on the first through-portion.