DIAMETER-WIRE DICING MACHINE
卷宗概要
申请人
MICRON DIAMOND WIRE & EQUIPMENT CO., LTD.
发明人
Cheng-Ming LEE
IPC 分类
CPC 分类
A diamond-wire dicing machine includes a machine chassis, which includes a bottom support. A base extends upwards from the bottom support. A plurality of tension regulation arms are arranged on the base and are each provided with a tension roller. A plurality of guide rollers are also arranged on the base. The tension rollers and the guide rollers are spaced from each other. A plurality of wire winding/releasing devices are respectively arranged at two sides of the base and are each provided with a wire winding/unwinding wheel. A diamond wire extends through the tension rollers, the guide rollers, and the wire winding/unwinding wheels, and the surface of the diamond wire is provided with diamond particles. The wire winding/releasing devices are operable to take up and release the diamond wire for reciprocally moving the diamond wire to bring new ones of the diamond particles to contact and cut a wafer.
原文（中文）
A diamond-wire dicing machine includes a machine chassis, which includes a bottom support. A base extends upwards from the bottom support. A plurality of tension regulation arms are arranged on the base and are each provided with a tension roller. A plurality of guide rollers are also arranged on the base. The tension rollers and the guide rollers are spaced from each other. A plurality of wire winding/releasing devices are respectively arranged at two sides of the base and are each provided with a wire winding/unwinding wheel. A diamond wire extends through the tension rollers, the guide rollers, and the wire winding/unwinding wheels, and the surface of the diamond wire is provided with diamond particles. The wire winding/releasing devices are operable to take up and release the diamond wire for reciprocally moving the diamond wire to bring new ones of the diamond particles to contact and cut a wafer.