PROTECTIVE FILM FORMATION AGENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP
卷宗概要
发明人
Hitomi MANIWA; Tetsuro KINOSHITA
IPC 分类
CPC 分类
A protective film forming agent for forming a protective film on a surface of a semiconductor wafer in dicing the semiconductor wafer, in which the protective film forming agent can form a protective film having excellent laser processability and reduced occurrence of cracks, and a method of manufacturing a semiconductor chip using the protective film forming agent. The protective film forming agent includes a water-soluble resin, a light absorbing agent, at least one monosaccharide or disaccharide plasticizer, and a solvent. The water-soluble resin may include a water-soluble resin having an aromatic ring and a water-soluble group.
原文（中文）
A protective film forming agent for forming a protective film on a surface of a semiconductor wafer in dicing the semiconductor wafer, in which the protective film forming agent can form a protective film having excellent laser processability and reduced occurrence of cracks, and a method of manufacturing a semiconductor chip using the protective film forming agent. The protective film forming agent includes a water-soluble resin, a light absorbing agent, at least one monosaccharide or disaccharide plasticizer, and a solvent. The water-soluble resin may include a water-soluble resin having an aromatic ring and a water-soluble group.