HYBRID MOISTURE-PROOF LAYER AND METHOD OF MANUFACTURING SAME
卷宗概要
申请人
KOREA ELECTRONICS TECHNOLOGY INSTITUTE
发明人
Soon Hyung KWON
IPC 分类
CPC 分类
Disclosed are a hybrid moisture-proof layer including a base film, a first moisture-proof layer formed by curing a first solution on the base film, a second moisture-proof layer formed by curing a second solution on the first moisture-proof layer, a mixed layer formed between the first moisture-proof layer and the second moisture-proof layer, and a third moisture-proof layer formed using a deposition process on the second moisture-proof layer, and a method of manufacturing the same.
原文（中文）
Disclosed are a hybrid moisture-proof layer including a base film, a first moisture-proof layer formed by curing a first solution on the base film, a second moisture-proof layer formed by curing a second solution on the first moisture-proof layer, a mixed layer formed between the first moisture-proof layer and the second moisture-proof layer, and a third moisture-proof layer formed using a deposition process on the second moisture-proof layer, and a method of manufacturing the same.