SUBSTRATE PROCESSING METHOD
卷宗概要
发明人
SeongMin Han; Seungju Chun; SungJoo Woo; SooHyun Baek; KyungHun Jang; Kwangman Ko; InGon Ryu; HieChul Kim
IPC 分类
CPC 分类
Provided is a method of improving a control time accuracy while a command signal is transmitted to a substrate processing apparatus from a controller, and a process stability while processing a substrate. A method of forming the film using it comprises inputting process control parameters into a first controller, downloading the process control parameters to a second controller from the first controller, and forming the film on the substrate.
原文（中文）
Provided is a method of improving a control time accuracy while a command signal is transmitted to a substrate processing apparatus from a controller, and a process stability while processing a substrate. A method of forming the film using it comprises inputting process control parameters into a first controller, downloading the process control parameters to a second controller from the first controller, and forming the film on the substrate.