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SYSTEMS, DEVICES, AND METHODS FOR HIGH-THROUGHPUT NON-CONTACT CHARACTERIZATION OF MATERIALS VIA VIBRATIONAL SIGNATURES

发明专利审中
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20权利要求 · 2 独立
§ Ⅰ

卷宗概要

发明人

Yun KAI; Thomas PEZERIL; Carlos M. PORTELA

IPC 分类

G1N 29/24B33Y 30/B33Y 50/2G1N 29/12

CPC 分类

G1N29/2418B33Y30/B33Y50/2G1N29/12

Systems, devices, and methods for measuring the dynamic properties of metamaterials at the microscale are provided. For example, laser-induced resonant acoustic spectroscopy (LIRAS) can be used as a non-destructive and/or non-contact optical framework within a material of interest to measure photoacoustic excitation of elastic waves. The system can include a pulsed-laser-based mechanical characterization technique that emits lasers at the sample of interest from various directions to demonstrate a high-throughput non-contact framework that employs MHz-wave propagation signatures to create a vibrational response. The vibrational response of the sample of interest can be used to extract dynamic mechanical properties thereof, such as omnidirectional elastic information, damping properties, and defect quantification. In some embodiments, the LIRAS technique can be employed in a characterization module within an additive manufacturing system to measure parameters of printed parts.

原文(中文)

Systems, devices, and methods for measuring the dynamic properties of metamaterials at the microscale are provided. For example, laser-induced resonant acoustic spectroscopy (LIRAS) can be used as a non-destructive and/or non-contact optical framework within a material of interest to measure photoacoustic excitation of elastic waves. The system can include a pulsed-laser-based mechanical characterization technique that emits lasers at the sample of interest from various directions to demonstrate a high-throughput non-contact framework that employs MHz-wave propagation signatures to create a vibrational response. The vibrational response of the sample of interest can be used to extract dynamic mechanical properties thereof, such as omnidirectional elastic information, damping properties, and defect quantification. In some embodiments, the LIRAS technique can be employed in a characterization module within an additive manufacturing system to measure parameters of printed parts.