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METHODS AND APPARATUSES FOR TESTING MULTI-DIE PACKAGE INTER-CONNECT LINKS
发明专利审中
20权利要求 · 3 独立
§ Ⅰ
卷宗概要
发明人
Rakesh KANDULA; Sriram VENKATESAN; Jeffrey SORIANO; Deep BAROT; Takeshi NAKAZAWA
IPC 分类
G1R 31/28
CPC 分类
G1R31/2853G1R31/2896
In some embodiments, techniques for testing die to die interconnect links are provided.
原文（中文）
In some embodiments, techniques for testing die to die interconnect links are provided.