MEMORY DAMAGE DETECTION DURING INTEGRATED CIRCUIT DEVICE BOOT

原文（中文）

Detecting damage to a memory of an integrated circuit device includes initiating a boot process of the integrated circuit device. The boot process is implemented by a boot processor of the integrated circuit device. As part of the boot process, a die crack test of a memory device of the integrated circuit device is initiated. The memory device is coupled to the boot processor. The boot processor receives a result of the die crack test of the memory device during the boot process. The result of the die crack test is stored in a register of the integrated circuit device.