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POLYMER FOR COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR MANUFACTURING THE SAME, COMPOSITION FOR FORMING ORGANIC FILM CONTAINING THE POLYMER, METHOD FOR FORMING ORGANIC FILM USING THE COMPOSITION, AND PATTERNING PROCESS USING THE COMPOSITION

发明专利审中
23权利要求 · 3 独立
§ Ⅰ

卷宗概要

发明人

Takashi SAWAMURA; Tomohiro IMATA; Satoshi MATSUBARA

IPC 分类

G3F 7/9G3F 7/16H1L 21/27H1L 21/33H1L 21/308H1L 21/311H1L 21/3213

CPC 分类

G3F7/91G3F7/94G3F7/162G3F7/167H1L21/276H1L21/332H1L21/337H1L21/3081H1L21/3086H1L21/31144H1L21/32139

A composition for forming an organic film, containing: resin and/or compound (A) for forming organic film; polymer (B) not containing halogen atom and containing repeating unit represented by following formula (1) and repeating unit represented by following formula (1′); and solvent (C), where Rand Rindependently represent saturated or unsaturated organic group having 1-20 carbon atoms and optionally having substituent, and “y” and “z” independently satisfy 0<y<1 and 0<z<1, wherein y+z=1. This can provide composition for forming organic film making it possible to form film excellent in coating property wherein coating defects, as pinholes on substrate (wafer), film-formability (in-plane uniformity), and filling property, composition not containing fluorine atom and containing particular polymer. Furthermore, the invention can provide method for forming organic film using composition for forming organic film, patterning process using composition for forming organic film, and polymer.

原文(中文)

A composition for forming an organic film, containing: resin and/or compound (A) for forming organic film; polymer (B) not containing halogen atom and containing repeating unit represented by following formula (1) and repeating unit represented by following formula (1′); and solvent (C), where Rand Rindependently represent saturated or unsaturated organic group having 1-20 carbon atoms and optionally having substituent, and “y” and “z” independently satisfy 0<y<1 and 0<z<1, wherein y+z=1. This can provide composition for forming organic film making it possible to form film excellent in coating property wherein coating defects, as pinholes on substrate (wafer), film-formability (in-plane uniformity), and filling property, composition not containing fluorine atom and containing particular polymer. Furthermore, the invention can provide method for forming organic film using composition for forming organic film, patterning process using composition for forming organic film, and polymer.