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ELECTRONIC DEVICE COMPRISING THICKNESS COMPENSATION MEMBER

发明专利审中
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15权利要求 · 1 独立
§ Ⅰ

卷宗概要

发明人

Sangyup LEE; Jeongseob KIM; Sungwu PARK; Seonguk PARK; Yonghee AN; Hyongrae CHO

IPC 分类

G6F 1/16

CPC 分类

G6F1/1641G6F1/1652G6F1/1669

An electronic device including a thickness compensation member is provided. The foldable electronic device includes a first housing having a first surface and a second surface positioned in the opposite direction of the first surface, a second housing, which is coupled so as to be rotatable with respect to the first housing, has a third surface extending from the first surface and a fourth surface positioned in the opposite direction of the third surface when the electronic device is unfolded, and has at least one part that is thinner than the first housing, a flexible display which is positioned on the first surface and the third surface, and which can be folded and unfolded according to the folding and unfolding of the electronic device, one or more processor arranged in the first housing, and a thickness compensation member for compensating for at least a portion of the thickness difference between the first housing and the second housing. The second housing can have an accommodation portion, which is on the fourth surface and can be detachably coupled to the thickness compensation member.

原文(中文)

An electronic device including a thickness compensation member is provided. The foldable electronic device includes a first housing having a first surface and a second surface positioned in the opposite direction of the first surface, a second housing, which is coupled so as to be rotatable with respect to the first housing, has a third surface extending from the first surface and a fourth surface positioned in the opposite direction of the third surface when the electronic device is unfolded, and has at least one part that is thinner than the first housing, a flexible display which is positioned on the first surface and the third surface, and which can be folded and unfolded according to the folding and unfolding of the electronic device, one or more processor arranged in the first housing, and a thickness compensation member for compensating for at least a portion of the thickness difference between the first housing and the second housing. The second housing can have an accommodation portion, which is on the fourth surface and can be detachably coupled to the thickness compensation member.