PASSIVE TEMPERATURE INDICATOR FOR A MODULE
卷宗概要
发明人
PER HENRIK FREMROT; SHREE RATHINASAMY; THOMAS J. DEPARI; GREGORY M. ALLEN
IPC 分类
CPC 分类
Devices, systems, and methods for managing a module for use with a chassis are disclosed. The module may include a body, a hardware component, positioned in the body, that consumes power to contribute to computer-implemented services provided by a data processing system housed by the chassis and that generates heat, a connector adapted to operably connect the hardware component to other hardware components of the data processing system, and a passive temperature indicator adapted to visually indicate a thermal state of at least a portion of the body.
原文（中文）
Devices, systems, and methods for managing a module for use with a chassis are disclosed. The module may include a body, a hardware component, positioned in the body, that consumes power to contribute to computer-implemented services provided by a data processing system housed by the chassis and that generates heat, a connector adapted to operably connect the hardware component to other hardware components of the data processing system, and a passive temperature indicator adapted to visually indicate a thermal state of at least a portion of the body.