METHOD AND APPARATUS FOR INSPECTING A WAFER
卷宗概要
申请人
Taiwan Semiconductor Manufacturing Company Limited
发明人
Yi-Hsi Chen; Cheng-Hung Chen; Chia Han Wu; Yen-Chia Liu; Hsu-Shui Liu
IPC 分类
CPC 分类
A method includes generating coherent light that has a wavefront, shaping the wavefront of the coherent light to provide the coherent light with a shaped wavefront, directing a probe beam of the coherent light with the shaped wavefront to an inspection surface of a wafer, causing a reflection beam to be reflected from the inspection surface of the wafer, capturing an image formed from the reflection beam reflected from the inspection surface of the wafer and generating image data related to the image, and analyzing the image data to determine whether there is a defect in the inspection surface of the wafer.
原文（中文）
A method includes generating coherent light that has a wavefront, shaping the wavefront of the coherent light to provide the coherent light with a shaped wavefront, directing a probe beam of the coherent light with the shaped wavefront to an inspection surface of a wafer, causing a reflection beam to be reflected from the inspection surface of the wafer, capturing an image formed from the reflection beam reflected from the inspection surface of the wafer and generating image data related to the image, and analyzing the image data to determine whether there is a defect in the inspection surface of the wafer.