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TAPE AND REEL (T&R) DEFECT IMAGE REVIEW AND REBINNING SYSTEMS AND METHODS

发明专利审中
20权利要求 · 3 独立
§ Ⅰ

卷宗概要

发明人

Shweta Deora; John Gao; Doug Hawks; Zhaojin Wen; Tuan Lam

IPC 分类

G6T 7/G6T 3/40G6T 5/50G6V 10/24G6V 10/762

CPC 分类

G6T7/8G6T3/40G6T5/50G6V10/245G6V10/762G6T2207/20081G6T2207/20084G6T2207/20221G6T2207/30152

Systems, methods, and computer program products for identifying defective dies at a die processing service with machine learning are provided. A training dataset comprising training images taken by one or more cameras at a tape and reel machine is provided to train a machine learning system. The training images include images of dies having integrated circuits. Positions of solder points are determined in each training image. The positions of solder points in each training image are aligned with positions of solder points in other training images to generate aligned positions of the solder points. The aligned positions are clustered into multiple clusters. A centroid position for each cluster is determined, where the centroid positions correspond to locations of the solder points across all images. The centroid positions are transmitted to the machine learning system in a production environment and are used to identify images with defective dies.

原文(中文)

Systems, methods, and computer program products for identifying defective dies at a die processing service with machine learning are provided. A training dataset comprising training images taken by one or more cameras at a tape and reel machine is provided to train a machine learning system. The training images include images of dies having integrated circuits. Positions of solder points are determined in each training image. The positions of solder points in each training image are aligned with positions of solder points in other training images to generate aligned positions of the solder points. The aligned positions are clustered into multiple clusters. A centroid position for each cluster is determined, where the centroid positions correspond to locations of the solder points across all images. The centroid positions are transmitted to the machine learning system in a production environment and are used to identify images with defective dies.