METHOD AND SYSTEM FOR DETECTING PRINTING DEFECTS IN A PHOTOLITHOGRAPHY MASK

原文（中文）

A method for detecting printing defects in a photolithography mask that will print on a wafer when using the photolithography mask in a specific photolithography system to print semiconductor structures on the wafer, the method comprising: acquiring a first aerial image of the photolithography mask using a mask inspection system; generating a second aerial image of the photolithography mask by applying a machine learning model () to the first aerial image, wherein the machine learning model is trained to map a first aerial image acquired by a mask inspection system to a second aerial image that emulates the application of the specific photolithography system to the photolithography mask; and detecting printing defects in the photolithography mask by comparing the second aerial image to a reference image.