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COIL ARRANGEMENT ON A MULTILAYER CIRCUIT BOARD, AND METHOD FOR PRODUCING A COIL ARRANGEMENT

发明专利审中
11权利要求 · 2 独立
§ Ⅰ

卷宗概要

IPC 分类

H1F 17/H1F 27/28

CPC 分类

H1F17/13H1F27/2804H1F2027/2809

A multilayer circuit board comprising a coil arrangement, the coil arrangement including a first coil having at least two turns, wherein the turns of the first coil are arranged above one another in separate layers of the multilayer circuit board and have the same first diameter; and a second coil having at least two turns, wherein the turns of the second coil are arranged above one another in separate layers of the multilayer circuit board and have the same second diameter; wherein the turns of the first coil and the turns of the second coil are arranged at least partially in the same layers of the multilayer circuit board; and wherein each turn of the turns of the first coil and the turns of the second coil is formed entirely in a respective single plane.

原文(中文)

A multilayer circuit board comprising a coil arrangement, the coil arrangement including a first coil having at least two turns, wherein the turns of the first coil are arranged above one another in separate layers of the multilayer circuit board and have the same first diameter; and a second coil having at least two turns, wherein the turns of the second coil are arranged above one another in separate layers of the multilayer circuit board and have the same second diameter; wherein the turns of the first coil and the turns of the second coil are arranged at least partially in the same layers of the multilayer circuit board; and wherein each turn of the turns of the first coil and the turns of the second coil is formed entirely in a respective single plane.