SUBSTRATE PROCESSING METHOD
卷宗概要
发明人
Kota TANIKAWA; Manabu TAKUSARI; Hiroyuki YASHIKI
IPC 分类
CPC 分类
A substrate processing method includes: holding a substrate having a first main surface and a second main surface; rotating the substrate and supplying a hydrofluoric acid-containing liquid to the second main surface of the substrate, the hydrofluoric acid-containing liquid containing hydrofluoric acid; after supplying the hydrofluoric acid-containing liquid to the second main surface of the substrate, rotating the substrate and supplying a rinse liquid to the second main surface of the substrate; and after supplying the rinse liquid to the second main surface of the substrate, rotating the substrate and supplying a hydrophobizing liquid to the first main surface of the substrate.
原文（中文）
A substrate processing method includes: holding a substrate having a first main surface and a second main surface; rotating the substrate and supplying a hydrofluoric acid-containing liquid to the second main surface of the substrate, the hydrofluoric acid-containing liquid containing hydrofluoric acid; after supplying the hydrofluoric acid-containing liquid to the second main surface of the substrate, rotating the substrate and supplying a rinse liquid to the second main surface of the substrate; and after supplying the rinse liquid to the second main surface of the substrate, rotating the substrate and supplying a hydrophobizing liquid to the first main surface of the substrate.