Through Substrate Via Formation on Patterned Substrates
卷宗概要
发明人
Elise LAFFOSSE; Charles Thomas CARLSON; Marvin Louis BERNT
IPC 分类
CPC 分类
Methods of processing a substrate are provided herein. In some embodiments, a method for processing a substrate includes: forming through via openings in a substrate from a back side of the substrate to a front side of the substrate, the substrate having front side metal interconnects disposed on the front side of the substrate that are exposed by the through via openings; and filling the through via openings to form through vias and forming back side metal interconnects on the back side of the substrate, wherein the back side metal interconnects are electrically coupled to the front side metal interconnects by the through vias.
原文（中文）
Methods of processing a substrate are provided herein. In some embodiments, a method for processing a substrate includes: forming through via openings in a substrate from a back side of the substrate to a front side of the substrate, the substrate having front side metal interconnects disposed on the front side of the substrate that are exposed by the through via openings; and filling the through via openings to form through vias and forming back side metal interconnects on the back side of the substrate, wherein the back side metal interconnects are electrically coupled to the front side metal interconnects by the through vias.