SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
卷宗概要
申请人
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
发明人
Kai-Chieh CHANG; Che-Chang HSU; Kai-Fa HO; Li-Jui CHEN
IPC 分类
CPC 分类
A method includes retrieving a first front opening unified pod (FOUP) from a FOUP stocker utilizing an interface module equipped with a transfer module; transporting the retrieved first FOUP via the transfer module across a first path within the interface module to align the first FOUP with an available first load port of a process tool; loading the first FOUP on the first load port; delivering wafers from the first FOUP to the process tool via the first load port to initiate a wafer processing operation using the wafers.
原文（中文）
A method includes retrieving a first front opening unified pod (FOUP) from a FOUP stocker utilizing an interface module equipped with a transfer module; transporting the retrieved first FOUP via the transfer module across a first path within the interface module to align the first FOUP with an available first load port of a process tool; loading the first FOUP on the first load port; delivering wafers from the first FOUP to the process tool via the first load port to initiate a wafer processing operation using the wafers.