WAFER CHUCKING SYSTEM
卷宗概要
发明人
Sunghyup KIM; Hyojin KOOK; Mijeong SHIN; Sebin CHOI
IPC 分类
CPC 分类
A wafer chucking system includes a membrane structure including a first layer having a first coefficient of thermal expansion (CTE) on which a wafer is mountable, and a second layer having a second CTE different from the first CTE, a temperature controller configured to thermally deform the membrane structure by heating or cooling the membrane structure, and an adsorber configured to adsorb the wafer on the membrane structure.
原文（中文）
A wafer chucking system includes a membrane structure including a first layer having a first coefficient of thermal expansion (CTE) on which a wafer is mountable, and a second layer having a second CTE different from the first CTE, a temperature controller configured to thermally deform the membrane structure by heating or cooling the membrane structure, and an adsorber configured to adsorb the wafer on the membrane structure.