FABRICATING INTEGRATED CIRCUIT PACKAGES WITH GLASS CORE HYBRID PANELS
卷宗概要
发明人
Soham Agarwal; Whitney Bryks; Aaditya Anand Candadai; Yi Cao; Kristof Darmawikarta; Gang Duan; Benjamin Duong; Jeremy Ecton; Mahdi Mohammadighaleni; Kari Hernandez; Andrew Jimenez; Houssam Jomaa; Manohar Konchady; Xinyu Li; Minglu Liu; Brandon Marin; Pratyush Mishra; Pratyasha Mohapatra; Seyyed Yahya Mousavi; Travis Palmer; Joseph Peoples; Srinivas Pietambaram; Bohan Shan; Joshua Stacey; Hiroki Tanaka; Yekan Wang; Hong Seung Yeon; Yingying Zhang
IPC 分类
CPC 分类
An apparatus comprises a glass core comprising a top surface and a bottom surface opposite the top surface. A plurality of vias extending between the top and bottom surfaces. A metallization layer is over at least a portion of the top surface. An edge is between the top and bottom surfaces. The edge comprises one or more protrusions or one or more cavities. Each of the protrusions or cavities comprises a first surface parallel to the top surface, a second surface non-parallel to the top surface, and a polymer or a metal on the first or second surface.
原文（中文）
An apparatus comprises a glass core comprising a top surface and a bottom surface opposite the top surface. A plurality of vias extending between the top and bottom surfaces. A metallization layer is over at least a portion of the top surface. An edge is between the top and bottom surfaces. The edge comprises one or more protrusions or one or more cavities. Each of the protrusions or cavities comprises a first surface parallel to the top surface, a second surface non-parallel to the top surface, and a polymer or a metal on the first or second surface.