GLASS CORE EDGE TREATMENTS FOR HYBRID PANELS IN DEVICE PACKAGING

原文（中文）

Hybrid panel for integrated circuit (IC) package assembly that has one or more glass core panels within a perimeter frame. The hybrid panel may offer better handling characteristics during a build-up of metallization features and dielectric layers upon the glass core panels. A glass edge of a glass core panel may be physically and/or chemically treated to improve adhesion of the glass core panel to the perimeter frame, for example with an intervening organic dielectric material. In some embodiments, the glass core panel edge may be chamfered or beveled. A glass edge bevel or chamfer may further have enhanced surface roughness. In some embodiments, a glass edge is chemically functionalized with surface groups, for example through plasma oxidation. An edge-treated glass core panel may be assembled with a frame that has a complementary recessing or protruding interior sidewall adjacent to the glass core panel.