TEMPERATURE MEASUREMENT DEVICE FOR MEASURING A SURFACE TEMPERATURE OF A SEMICONDUCTOR PACKAGE
卷宗概要
发明人
Eyal Hamo; Eran Moshe; Apratim Sanyal
IPC 分类
CPC 分类
A semiconductor package includes at least one internal temperature sensor to detect an operating temperature of the semiconductor package. The operating temperature is based on a surface temperature of an enclosure of the semiconductor package. As such, the at least one internal temperature sensor is positioned within a cavity defined by the enclosure to measure the temperature of the enclosure. The at least one internal temperature sensor can be coupled to an inner side of the enclosure or it can be proximate to the enclosure. Temperature measurements provided by the at least one internal temperature sensor are used to determine whether the semiconductor package is operating within operating temperature ranges specified by one or more standards.
原文（中文）
A semiconductor package includes at least one internal temperature sensor to detect an operating temperature of the semiconductor package. The operating temperature is based on a surface temperature of an enclosure of the semiconductor package. As such, the at least one internal temperature sensor is positioned within a cavity defined by the enclosure to measure the temperature of the enclosure. The at least one internal temperature sensor can be coupled to an inner side of the enclosure or it can be proximate to the enclosure. Temperature measurements provided by the at least one internal temperature sensor are used to determine whether the semiconductor package is operating within operating temperature ranges specified by one or more standards.