DEVICE, METHOD AND SYSTEM TO CONDUCT HEAT THROUGH AN ACTIVE LAYER OF AN INTEGRATED CIRCUIT DIE

原文（中文）

Techniques and mechanisms to facilitate a conduction of heat across one or more active layers of an integrated circuit (IC) die. In an embodiment, an IC die comprises vertically stacked active layers, where metallization layers are variously disposed on opposite sides of a first such active layer. A thermal channel structure of the IC die extends through said first active layer, and through the metallization layers, to each of two thermally conductive material layers. Thermal interface structures are variously disposed each between a different respective distal end of the thermal channel structure and a different respective one of the thermally conductive material layers. In another embodiment, the thermal channel structure comprises a substantially columnar main body portion, which is electrically coupled to one or more interconnect structures of the metallization layers.