HEAT SPREADING AND THERMAL HEAT REMOVAL STRUCTURES
卷宗概要
申请人
International Business Machines Corporation
发明人
John Knickerbocker; Keiji Matsumoto; Aakrati Jain; Prabudhya Roy Chowdhury
IPC 分类
CPC 分类
Semiconductor structures are provided in which heat spreading and thermal heat removal are improved by providing one or more heat removal paths in which heat spreading and thermal heat removal occurs leveraging horizontal direction and vertical directions and through reduced resistance of heat removal paths. Notably, heat is spread horizontally to the edges of the semiconductor structures and then the heat is removed vertically (up and/or down) from the semiconductor structures.
原文（中文）
Semiconductor structures are provided in which heat spreading and thermal heat removal are improved by providing one or more heat removal paths in which heat spreading and thermal heat removal occurs leveraging horizontal direction and vertical directions and through reduced resistance of heat removal paths. Notably, heat is spread horizontally to the edges of the semiconductor structures and then the heat is removed vertically (up and/or down) from the semiconductor structures.