BACKSIDE POWER DELIVERY NETWORK HEAT DISSIPATION
卷宗概要
申请人
International Business Machines Corporation
发明人
HUIMEI ZHOU; Oleg Gluschenkov; Ruilong Xie
IPC 分类
CPC 分类
A structure comprising: a back-end-of-line portion on top of a device, wherein the device comprises a hot circuit and a cold circuit; a wafer on top of the back-end-of-line portion; a backside power distribution network on a side of the wafer; a thermal sink underneath the device and the backside power distribution network; and one or more scaling balls underneath the thermal sink and on top of a laminate.
原文（中文）
A structure comprising: a back-end-of-line portion on top of a device, wherein the device comprises a hot circuit and a cold circuit; a wafer on top of the back-end-of-line portion; a backside power distribution network on a side of the wafer; a thermal sink underneath the device and the backside power distribution network; and one or more scaling balls underneath the thermal sink and on top of a laminate.