ELECTRONIC PACKAGE

原文（中文）

An electronic package is provided and includes a carrier structure, an electronic component disposed on the carrier structure, a heat dissipation structure disposed on the electronic component via a thermal interface material, a back side metallization formed on the electronic component and connected to the thermal interface material, and a conductive adhesive provided between the thermal interface material and the back side metallization. The surface adhesiveness of the conductive adhesive is used to limit the displacement of the thermal interface material relative to the back side metallization, thereby preventing the displacement of the thermal interface material from causing poor bonding between the heat dissipation structure and the electronic component, which would affect the heat dissipation efficiency of the electronic package.