CHIP PACKAGE STRUCTURE

原文（中文）

A chip package structure includes a ceramic substrate, a copper structure, a noble metal layer, a chip, and an encapsulation gel. The copper structure is formed on the ceramic substrate, and at least one sidewall of the copper structure is recessed to form a groove. The noble metal layer is formed on the copper structure. The chip is disposed on the noble metal layer. The encapsulation gel is formed on the ceramic substrate to encapsulate the copper structure, the noble metal layer, and the chip. A surface treatment layer is formed on an exposed copper surface of the copper structure that is not in contact with the ceramic substrate and the noble metal layer, and the encapsulation gel contacts the surface treatment layer for bonding to the copper structure. The surface treatment layer extends to a surface inside the groove, and the encapsulation gel further fills the groove.