ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

原文（中文）

In one example, an electronic device includes a die paddle and leads. An electronic component is coupled to the die paddle and to the leads. A heat sink is coupled to the electronic component. An encapsulant covers the die paddle, the leads, the electronic component, and the heat sink. The encapsulant comprises an encapsulant top side, an encapsulant bottom side opposite to the encapsulant top side, an encapsulant lateral side connecting the encapsulant top side to the encapsulant, and a top extension region. A top side of the heat sink is exposed from the encapsulant top side. A bottom side of the die paddle is exposed from the encapsulant bottom side. Parts of the leads are exposed from the encapsulant lateral side. The top extension region of the encapsulant covers a top side peripheral edge of the heat sink. Other examples and related methods are also disclosed herein.