INDUCTOR STRUCTURES IN HYBRID BONDED DEVICES
卷宗概要
申请人
International Business Machines Corporation
发明人
Kishan Jayanand; Nicholas Alexander Polomoff; Viswas Purohit; Nicholas Latham; Ashim Dutta; Chih-Chao Yang
IPC 分类
CPC 分类
A device comprises a first semiconductor structure disposed on a second semiconductor structure, and a plurality of metal structures at an interface portion of the first semiconductor structure and the second semiconductor structure. The first semiconductor structure comprises a first part of an inductor structure and the second semiconductor structure comprises a second part of the inductor structure. The plurality of metal structures connect the first part of the inductor structure with the second part of the inductor structure.
原文（中文）
A device comprises a first semiconductor structure disposed on a second semiconductor structure, and a plurality of metal structures at an interface portion of the first semiconductor structure and the second semiconductor structure. The first semiconductor structure comprises a first part of an inductor structure and the second semiconductor structure comprises a second part of the inductor structure. The plurality of metal structures connect the first part of the inductor structure with the second part of the inductor structure.