INTERCONNECT STRUCTURE WITH HYBRID BOND ANTI-FUSES
卷宗概要
申请人
International Business Machines Corporation
发明人
Nicholas Alexander POLOMOFF; Mukta Ghate Farooq
IPC 分类
CPC 分类
An interconnect structure includes hybrid-bonded first and second interposers. The first interposer has a first surface including a layer of insulation and a BEOL below the layer of insulation. The layer of insulation has a first recess in the layer exposing a metal conductor of the BEOL, and the first recess is filled with a material changing from nonconducting to conducting upon being heated above a predetermined temperature. The layer of insulation has a second recess in the layer exposing a metal conductor of the BEOL, and the second recess is filled with metal. The second interposer has a similar construction. Upon hybrid bonding, the material that changes from non-conducting to conducting forms an anti-fuse.
原文（中文）
An interconnect structure includes hybrid-bonded first and second interposers. The first interposer has a first surface including a layer of insulation and a BEOL below the layer of insulation. The layer of insulation has a first recess in the layer exposing a metal conductor of the BEOL, and the first recess is filled with a material changing from nonconducting to conducting upon being heated above a predetermined temperature. The layer of insulation has a second recess in the layer exposing a metal conductor of the BEOL, and the second recess is filled with metal. The second interposer has a similar construction. Upon hybrid bonding, the material that changes from non-conducting to conducting forms an anti-fuse.