ELECTRONIC DEVICE
卷宗概要
发明人
Chia-Ping TSENG; Po-Yun HSU
IPC 分类
CPC 分类
An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, a seed layer, and a conductor layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate includes a through hole, and the through hole has a sidewall connected to the first surface and the second surface. The seed layer is disposed on the first surface, the second surface, and the sidewall. The conductor layer is disposed on the seed layer, and a roughness of a surface of the seed layer is greater than or equal to 1 nm and less than or equal to 1 μm.
原文（中文）
An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, a seed layer, and a conductor layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate includes a through hole, and the through hole has a sidewall connected to the first surface and the second surface. The seed layer is disposed on the first surface, the second surface, and the sidewall. The conductor layer is disposed on the seed layer, and a roughness of a surface of the seed layer is greater than or equal to 1 nm and less than or equal to 1 μm.