SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

原文（中文）

A substrate structure and a manufacturing method thereof are provided, in which a core layer having first and second connection pads is formed, and first bonding pads of a first circuit build-up layer and second bonding pads of a second circuit build-up layer are respectively bonded to the first connection pads and the second connection pads, so that the first circuit build-up layer and the second circuit build-up layer are respectively located on a first side and a second side of the core layer, and a first gap is formed between the first side and the first circuit build-up layer, and a second gap is formed between the second side and the second circuit build-up layer. Thereby, the core layer and the first and second circuit build-up layers can be manufactured separately and concurrently, thereby shortening the manufacturing process of the substrate structure and improving the yield of the substrate structure.