PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
卷宗概要
发明人
Tae Hong MIN; Jong Eun PARK
IPC 分类
CPC 分类
The present disclosure relates to a printed circuit board including: a frame having a through-portion; a glass layer at least partially disposed within the through-portion; a first insulating material filling at least a portion of a space between the frame and the glass layer; a second insulating material disposed on upper sides of the frame and the glass layer; and a third insulating material disposed on lower sides of the frame and the glass layer, and the first insulating material includes a material different from the second and third insulating materials.
原文（中文）
The present disclosure relates to a printed circuit board including: a frame having a through-portion; a glass layer at least partially disposed within the through-portion; a first insulating material filling at least a portion of a space between the frame and the glass layer; a second insulating material disposed on upper sides of the frame and the glass layer; and a third insulating material disposed on lower sides of the frame and the glass layer, and the first insulating material includes a material different from the second and third insulating materials.