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DATA CENTER

发明专利审中
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25权利要求 · 4 独立
§ Ⅰ

卷宗概要

IPC 分类

H5K 7/20H5K 7/14

CPC 分类

H5K7/20745H5K7/1497H5K7/20145H5K7/20754

A multi-level data center building, and a method of cooling servers in the building is disclosed. The building may have at least three data levels, each accommodating rack-storage areas for rows of server racks separating alternating hot and cold aisles, a plurality of air-handling units for supplying cooling air to the servers via the cold aisles, a cold-air supply corridor for transporting cold air from the air-handling units to the cold aisles and for providing access to the cold aisles, and a warm air return path for transporting warm air from the hot aisles to the air-handling units. Ends of cold aisles may be along a first side of the corridor, and the air-handing units along a second side opposite the first side. The rack storage areas, cold aisles, hot aisles, cold air supply corridor, warm air return path, and the air-handling units are within the building envelope.

原文(中文)

A multi-level data center building, and a method of cooling servers in the building is disclosed. The building may have at least three data levels, each accommodating rack-storage areas for rows of server racks separating alternating hot and cold aisles, a plurality of air-handling units for supplying cooling air to the servers via the cold aisles, a cold-air supply corridor for transporting cold air from the air-handling units to the cold aisles and for providing access to the cold aisles, and a warm air return path for transporting warm air from the hot aisles to the air-handling units. Ends of cold aisles may be along a first side of the corridor, and the air-handing units along a second side opposite the first side. The rack storage areas, cold aisles, hot aisles, cold air supply corridor, warm air return path, and the air-handling units are within the building envelope.