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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

发明专利审中
20权利要求 · 2 独立
§ Ⅰ

卷宗概要

发明人

Takuto WATANABE; Takahiro MORI

IPC 分类

H10D 84/83H10D 62/10H10D 84/1

CPC 分类

H10D84/835H10D62/109H10D84/13H10D84/151H10D84/156

An n-type source region and an n-type drain region NDare formed in a semiconductor substrate. A gate electrode is formed via a gate insulating film on a portion of the semiconductor substrate located between the source region and the drain region. A p-type impurity region is: formed in a portion of the semiconductor substrate located under the drain region, under the gate electrode, and under the source region. An impurity concentration of the impurity region is higher than an impurity concentration of the semiconductor substrate. The impurity region is spaced apart from an upper surface of the semiconductor substrate.

原文(中文)

An n-type source region and an n-type drain region NDare formed in a semiconductor substrate. A gate electrode is formed via a gate insulating film on a portion of the semiconductor substrate located between the source region and the drain region. A p-type impurity region is: formed in a portion of the semiconductor substrate located under the drain region, under the gate electrode, and under the source region. An impurity concentration of the impurity region is higher than an impurity concentration of the semiconductor substrate. The impurity region is spaced apart from an upper surface of the semiconductor substrate.