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Nanoribbon Transistors Formed from Layered Materials with Dopant for Reduced Strain

发明专利审中
20权利要求 · 3 独立
§ Ⅰ

卷宗概要

申请人

David KOHEN; Rambert NAHM; Glenn A. GLASS; Borna OBRADOVIC; Stephen M. CEA; Matthew V. METZ; Siddharth CHOUKSEY; Jessica M. TORRES; Peter WELLS; Susmita GHOSE; Michael BABB; Natalie BRIGGS

发明人

David KOHEN; Rambert NAHM; Glenn A. GLASS; Borna OBRADOVIC; Stephen M. CEA; Matthew V. METZ; Siddharth CHOUKSEY; Jessica M. TORRES; Peter WELLS; Susmita GHOSE; Michael BABB; Natalie BRIGGS

IPC 分类

H10D 84/85H10D 84/1

CPC 分类

H10D84/856H10D84/167H10D84/186H10D84/851

A dopant may included in one or more sacrificial layers, e.g., silicon layers or silicon germanium layers, used for forming nanoribbon transistors. Adding a dopant to a silicon germanium layer may cause the silicon germanium to be more stress neutral, to prevent relaxation after etching stacks of individuated nanoribbons. Alternatively, when added to one or more sacrificial layers of silicon, the doped silicon layers may counteract elastic stress from the silicon germanium layers. The dopant layers may be included at various positions in a stack of materials. The dopant layer may include one or more dopants selected from carbon, arsenic, boron, and phosphorus.

原文(中文)

A dopant may included in one or more sacrificial layers, e.g., silicon layers or silicon germanium layers, used for forming nanoribbon transistors. Adding a dopant to a silicon germanium layer may cause the silicon germanium to be more stress neutral, to prevent relaxation after etching stacks of individuated nanoribbons. Alternatively, when added to one or more sacrificial layers of silicon, the doped silicon layers may counteract elastic stress from the silicon germanium layers. The dopant layers may be included at various positions in a stack of materials. The dopant layer may include one or more dopants selected from carbon, arsenic, boron, and phosphorus.