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MANUFACTURING METHOD FOR LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE THEREBY

发明专利审中
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19权利要求 · 5 独立
§ Ⅰ

卷宗概要

发明人

Hae-Yong JEONG; Chan Soo SHIN; Hyeong Ho PARK; Shin Keun KIM

IPC 分类

H10H 20/1

CPC 分类

H10H20/17H10H20/137

Disclosed are a method of manufacturing a light-emitting apparatus and a light-emitting apparatus manufactured thereby, wherein the method includes a step of forming a T-shaped light-emitting rod, a step of forming a sacrificial layer on a support substrate and forming an insulating layer on the sacrificial layer, a step of forming a coupling recess in the insulating layer, coupling the T-shaped light-emitting rod to the coupling recess, and laying and aligning the T-shaped light-emitting rod on the support substrate in a lateral direction (├), a step of forming a first electrode and forming a second electrode connected to the second conductive semiconductor layer to form a T-shaped light-emitting rod structure, a step of transferring the T-shaped light-emitting rod structure to a target substrate, and a step of removing the sacrificial layer and removing the support substrate.

原文(中文)

Disclosed are a method of manufacturing a light-emitting apparatus and a light-emitting apparatus manufactured thereby, wherein the method includes a step of forming a T-shaped light-emitting rod, a step of forming a sacrificial layer on a support substrate and forming an insulating layer on the sacrificial layer, a step of forming a coupling recess in the insulating layer, coupling the T-shaped light-emitting rod to the coupling recess, and laying and aligning the T-shaped light-emitting rod on the support substrate in a lateral direction (├), a step of forming a first electrode and forming a second electrode connected to the second conductive semiconductor layer to form a T-shaped light-emitting rod structure, a step of transferring the T-shaped light-emitting rod structure to a target substrate, and a step of removing the sacrificial layer and removing the support substrate.