LIGHT-EMITTING SUBSTRATE, BACKLIGHT MODULE AND DISPLAY APPARATUS
卷宗概要
申请人
Hefei BOE Ruisheng Technology Co., Ltd.; BOE TECHNOLOGY GROUP CO., LTD.
发明人
Yiding SUN; Bing ZHANG; Hai TANG; Liang GAO; Xiaolin GENG; Jianwei QIN; Xiao WANG
IPC 分类
CPC 分类
A light-emitting substrate includes a back plate, light-emitting groups, a bonding electrode group, and a flexible circuit structure including a gold finger electrically connected to the bonding electrode group. A light-emitting region of the light-emitting substrate is provided with at least one light-emitting group including a first light-emitting group. The bonding electrode group includes: a first bonding electrode and remaining bonding electrodes, and at least one redundant bonding electrode between the first bonding electrode and an adjacent remaining bonding electrode. A second power supply voltage terminal of the first light-emitting group and the first bonding electrode are electrically connected to a feedback signal line. On the back plate, an orthographic projection of the gold finger overlaps with an orthographic projection of the bonding electrode group. An impedance between the first bonding electrode and the adjacent remaining bonding electrode is larger than that between two adjacent and consecutive remaining bonding electrodes.
原文（中文）
A light-emitting substrate includes a back plate, light-emitting groups, a bonding electrode group, and a flexible circuit structure including a gold finger electrically connected to the bonding electrode group. A light-emitting region of the light-emitting substrate is provided with at least one light-emitting group including a first light-emitting group. The bonding electrode group includes: a first bonding electrode and remaining bonding electrodes, and at least one redundant bonding electrode between the first bonding electrode and an adjacent remaining bonding electrode. A second power supply voltage terminal of the first light-emitting group and the first bonding electrode are electrically connected to a feedback signal line. On the back plate, an orthographic projection of the gold finger overlaps with an orthographic projection of the bonding electrode group. An impedance between the first bonding electrode and the adjacent remaining bonding electrode is larger than that between two adjacent and consecutive remaining bonding electrodes.