PANEL RELEASE SYSTEM AND A METHOD OF OPERATING THE SAME

原文（中文）

There may be provided a release workstation, processing or panel release system including the release workstation, and methods of operating the same. The processing or panel release system may include a carrier-support deck having a deck surface capable of supporting an intermediate panel-carrier assembly thereon, and a release-heater associated with the deck surface and operable to heat the intermediate panel-carrier assembly to a heat release temperature. The release workstation may include a release unit having a release-head movable towards the deck surface of the carrier-support deck to engage a molded panel of the intermediate panel-carrier assembly on the deck surface. The release-head may include a retaining member configured to releasably retain the molded panel to an engagement surface of the release-head. The release-head may further be movable away from the deck surface of the carrier-support deck, with the retaining member of the release-head releasably retaining the molded panel.