原始名称记载: Taiwan semiconductor Manufacturing Co., Ltd.

In an embodiment, a semiconductor package may include a photonic integrated circuit (PIC) die having a wavelength modulator and a heating element thermally coupled to the wavelength modulator. The semiconductor package may also include an interconnect structure on the PIC die, where the interconnect structure may include a plurality of conductive features and a void. The void overlaps with the heating element and the wavelength modulator from a top view. The package may furthermore include a plurality of conductive connectors over the interconnect structure and electrically connected to the plurality of conductive features.