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SEMICONDUCTOR PACKAGE HAVING LEAD FRAME WITH LEADS OF DIFFERENT SIZES AND METHOD OF MANUFACTURE
发明专利审中
3浏览
§ Ⅰ
卷宗概要
发明人
Halba, Rohit; Gupta, Pawan Kumar; Tiwari, Swapnil; Liu, Huanhuan
申请日
Jun 25, 2025
公开日
Jan 6, 2026
IPC 分类
H01LH01LH01LH01LH01L
CPC 分类
H01LH01LH01LH01LH01LH01LH01LH01LH01LH01LH01LH01L