SUBSTRATE SEPARATION APPARATUS AND CONTROL METHOD THEREOF
卷宗概要
发明人
Sung Won MO; Seung Hoon LEE; Heung Soo HAN; Jin Uk KIM; Yu Jin PARK
IPC 分类
CPC 分类
The present invention relates to a substrate separation apparatus, and the substrate separation apparatus includes a separation member () that enters a bonded portion () of a bonded substrate () in which a first substrate () and a second substrate () are bonded, and forms a crack, a sensor module () configured to photograph the bonded substrate () and the separation member () to obtain measurement values corresponding to distances from the sensor module () to the bonded substrate () and the separation member (), and a processor () configured to move the separation member () to a height of the bonded portion () on the basis of the measurement values.
原文（中文）
The present invention relates to a substrate separation apparatus, and the substrate separation apparatus includes a separation member () that enters a bonded portion () of a bonded substrate () in which a first substrate () and a second substrate () are bonded, and forms a crack, a sensor module () configured to photograph the bonded substrate () and the separation member () to obtain measurement values corresponding to distances from the sensor module () to the bonded substrate () and the separation member (), and a processor () configured to move the separation member () to a height of the bonded portion () on the basis of the measurement values.