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THERMOPLASTIC COMPOSITION FOR LASER DIRECT STRUCTURING

发明专利审中
22权利要求 · 3 独立
§ Ⅰ

卷宗概要

申请人

MCE TECHNICAL CENTER B.V.

发明人

Bernardus Antonius Gerardus SCHRAUWEN; Fabio PAOLUCCI

IPC 分类

C8G 64/4C8K 3/11

CPC 分类

C8G64/4C8K3/11

A thermoplastic composition having an aromatic polycarbonate and a copper chromite spinel laser direct structuring additive. The composition includes a) 85-95 wt. % of an aromatic polycarbonate; b) 2-15 wt. % of a copper chromite spinel laser direct structuring additive, c) 0.05-5 wt. % of a flame retardant, which is a flame retardant salt or organic flame retardant, d) 0.1-2 wt. % of an acid-modified polymer, and e) optionally 0-5 wt. % of a siloxane based rubber. A molded part having the composition, a process for producing a circuit carrier with the molded part, and to a circuit carrier obtainable by the process.

原文(中文)

A thermoplastic composition having an aromatic polycarbonate and a copper chromite spinel laser direct structuring additive. The composition includes a) 85-95 wt. % of an aromatic polycarbonate; b) 2-15 wt. % of a copper chromite spinel laser direct structuring additive, c) 0.05-5 wt. % of a flame retardant, which is a flame retardant salt or organic flame retardant, d) 0.1-2 wt. % of an acid-modified polymer, and e) optionally 0-5 wt. % of a siloxane based rubber. A molded part having the composition, a process for producing a circuit carrier with the molded part, and to a circuit carrier obtainable by the process.