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TWO-COMPONENT THERMALLY-CONDUCTIVE STRUCTURAL ADHESIVE
发明专利审中
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15权利要求 · 1 独立
§ Ⅰ
卷宗概要
申请人
DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
发明人
Felix KOCH; Beda STEINER
IPC 分类
C9J 163/C9J 9/C9J 11/6C9J 11/8
CPC 分类
C9J163/C9J9/C9J11/6C9J11/8C9J2400/20C9J2475/
Provided herein is a two-component thermally-conductive epoxy adhesive.
原文（中文）
Provided herein is a two-component thermally-conductive epoxy adhesive.