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PRODUCTION METHOD FOR ETCHING LIQUID COMPOSITION

发明专利审中
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16权利要求 · 3 独立
§ Ⅰ

卷宗概要

发明人

Yosuke KIMURA; Kanji SATO

IPC 分类

C23F 1/26C23F 11/14

CPC 分类

C23F1/26C23F11/141

In one aspect, provided is a method for producing an etchant composition that is able to reduce dripping during the filling of a container with the etchant composition. An aspect of the present disclosure relates to a method for producing an etchant composition. The etchant composition is used to etch a metal film that is disposed on a substrate. The method includes filing a container with the etchant composition by using a filing nozzle with a filling port through which the etchant composition is discharged. A receding contact angle of the etchant composition with respect to a raw material of the filing port of the filling nozzle is 60° or more, and the ratio of an advancing contact angle to a receding contact angle (advancing contact angle/receding contact angle) of the etchant composition is 1.4 or less.

原文(中文)

In one aspect, provided is a method for producing an etchant composition that is able to reduce dripping during the filling of a container with the etchant composition. An aspect of the present disclosure relates to a method for producing an etchant composition. The etchant composition is used to etch a metal film that is disposed on a substrate. The method includes filing a container with the etchant composition by using a filing nozzle with a filling port through which the etchant composition is discharged. A receding contact angle of the etchant composition with respect to a raw material of the filing port of the filling nozzle is 60° or more, and the ratio of an advancing contact angle to a receding contact angle (advancing contact angle/receding contact angle) of the etchant composition is 1.4 or less.