METAL FOIL CONTINUOUS PLATING APPARATUS, METAL FOIL CONTINUOUS PLATING METHOD, AND METHOD FOR MANAGING ELECTROLYTE SOLUTION OF CONTINUOUS PLATING APPARATUS

原文（中文）

A metal foil continuous plating apparatus includes an electrolytic bath for accommodating an electrolyte solution, a positive electrode arranged inside the electrolytic bath, a negative electrode arranged at a predetermined interval from the positive electrode so as to face the positive electrode, and a power supply device for applying a current to the positive electrode and the negative electrode, wherein the electrolyte solution is supplied to one side of a space formed between the positive electrode and the negative electrode, and the electrolyte solution is discharged from the other side of the space, wherein the height of the one side to which the electrolyte solution is supplied is formed higher than that of the other side so that the metal ions contained in the electrolyte solution are electro-deposited on the negative electrode, thereby forming a metal foil.