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Transistor IC Apparatus with Integrated Temperature Sensing

发明专利审中
6浏览
20权利要求 · 3 独立
§ Ⅰ

卷宗概要

发明人

Zachary Lee; Vijay Reddy

IPC 分类

G1K 7/1H1L 23/34H1L 29/6H1L 29/40H1L 29/66H1L 29/78

CPC 分类

G1K7/15H1L23/34H10D30/281H10D30/657H10D62/116H10D62/127H10D64/111

The present disclosure introduces an IC apparatus that includes a transistor and circuitry, as well as method of manufacture of such IC apparatus. The transistor is constructed in layers formed in or over a semiconductor substrate and includes a polysilicon member proximate a feature of the transistor. The circuitry includes two connections to the polysilicon member and is configured to detect a temperature-dependent characteristic of the polysilicon member. The transistor may also or instead include oppositely doped portions of the semiconductor substrate, which form a junction diode. The circuitry may also or instead include connections to the oppositely doped substrate portions and may be configured to detect a temperature-dependent characteristic of the junction diode.

原文(中文)

The present disclosure introduces an IC apparatus that includes a transistor and circuitry, as well as method of manufacture of such IC apparatus. The transistor is constructed in layers formed in or over a semiconductor substrate and includes a polysilicon member proximate a feature of the transistor. The circuitry includes two connections to the polysilicon member and is configured to detect a temperature-dependent characteristic of the polysilicon member. The transistor may also or instead include oppositely doped portions of the semiconductor substrate, which form a junction diode. The circuitry may also or instead include connections to the oppositely doped substrate portions and may be configured to detect a temperature-dependent characteristic of the junction diode.