Multi-Channel Workpiece Inspection System
卷宗概要
发明人
Edward Robert Van Brunt; Jared A. Langan; Charles Henry Van Brackle
IPC 分类
CPC 分类
Described herein are systems and methods relating to inspecting semiconductor workpieces. In one example, the inspection system includes a first channel having a first imaging device configured to image the semiconductor workpiece on the workpiece using a first radiation source. The inspection system includes a second channel having a second imaging device configured to image the semiconductor workpiece on the workpiece holder using a second radiation source.
原文（中文）
Described herein are systems and methods relating to inspecting semiconductor workpieces. In one example, the inspection system includes a first channel having a first imaging device configured to image the semiconductor workpiece on the workpiece using a first radiation source. The inspection system includes a second channel having a second imaging device configured to image the semiconductor workpiece on the workpiece holder using a second radiation source.