Semiconductor Workpiece Inspection System
卷宗概要
发明人
Jared A. Langan; Charles Henry Van Brackle; Edward Robert Van Brunt
IPC 分类
CPC 分类
Semiconductor workpiece inspection systems are provided. In some examples, a semiconductor workpiece inspection system includes a radiation source configured to provide electromagnetic radiation to a semiconductor workpiece. In some implementations, the example semiconductor workpiece inspection system includes an imaging device configured to capture an image of at least a portion of the semiconductor workpiece. In some implementations, the radiation source is configured to provide the electromagnetic radiation such that the electromagnetic radiation is incident on a surface of the semiconductor workpiece at an incident angle relative to an axis normal to a major surface of the semiconductor workpiece that is in a range of about 45° to about 85°.
原文（中文）
Semiconductor workpiece inspection systems are provided. In some examples, a semiconductor workpiece inspection system includes a radiation source configured to provide electromagnetic radiation to a semiconductor workpiece. In some implementations, the example semiconductor workpiece inspection system includes an imaging device configured to capture an image of at least a portion of the semiconductor workpiece. In some implementations, the radiation source is configured to provide the electromagnetic radiation such that the electromagnetic radiation is incident on a surface of the semiconductor workpiece at an incident angle relative to an axis normal to a major surface of the semiconductor workpiece that is in a range of about 45° to about 85°.