APPARATUS AND METHOD FOR TESTING A SEMICONDUCTOR PACKAGE
卷宗概要
发明人
JuNo LIM; WonJae LEE; SeungJun BAEK
IPC 分类
CPC 分类
A apparatus for testing a semiconductor package comprises: a test board; a reference module disposed on the test board, wherein the reference module has a base substrate with a set of test pads and at least one reference electronic component mounted on the base substrate, the at least one reference electronic component has a same composition and layout as the at least one electronic component of the semiconductor package; and a test socket disposed on the test board, wherein the test socket comprises: a socket body for accommodating the reference module and the semiconductor package; and contact pins vertically extending through the socket body to set up an electrical connection between the set of conductive pads of the semiconductor component and the set of test pads of the reference module.
原文（中文）
A apparatus for testing a semiconductor package comprises: a test board; a reference module disposed on the test board, wherein the reference module has a base substrate with a set of test pads and at least one reference electronic component mounted on the base substrate, the at least one reference electronic component has a same composition and layout as the at least one electronic component of the semiconductor package; and a test socket disposed on the test board, wherein the test socket comprises: a socket body for accommodating the reference module and the semiconductor package; and contact pins vertically extending through the socket body to set up an electrical connection between the set of conductive pads of the semiconductor component and the set of test pads of the reference module.